Sizzix MAGNETIC DIE BRUSH KIT For Wafer Thin Dies

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout. Easily attaching to the bottom of your Die Brush, the Magnetic Pickup Tool quickly and easily picks up all metallic chemically-etched dies, including Thinlits and Triplits, and acts as a base for Die Brush to stand on its own.
Die Brush is approx. 5.5 x 1.75 x 0.25 inches. Foam Pad is approx. 4.5 x 7.25 inches.