Sizzix Die Brush & Foam Pad For Wafer Thin Dies

When it comes to removing excess paper in all brands of wafer-thin, chemically-etched dies, the Sizzix Die Brush does it easily and ergonomically. With a sleek, ergonomic rubber-grip handle for non-slippage and easy maneuverability, the Die Brush easily rolls away excess paper to reveal the perfect cut! The Die Brush includes a Foam Pad that acts as the perfect work surface for removing excess paper from the dies and even the cutout.
The Die Brush measures approximately 5 1/2 x 1 3/4 x 1 1/4 inches and the Foam Pad measures approximately 4 1/2 x 7 1/4 inches. Replacement Brush Heads and Foam Pads are sold separately.